Copper
Copper layers possess good adhesion properties and are ductile (easily deformable). Copper plating often serves as a carrier or intermediate layer for top layers such as nickel, tin, tin-lead alloy and silver on ferrous and non-ferrous materials. Copper is mainly used as the final layer in relay parts for corrosion protection of magnetic iron base materials.
Copper acid
riag Cu 375Acid bright copper bath for high brilliance, low-stressed and ductile deposits | |
Copper alkaline - cyanide free
riag Cu 385 flyerCu 385 - alkaline, cyanide-free bright copper process | |
riag Cu 385Alkaline, non-cyanide bright copper process | |
riag Cu 386Alkaline, non-cyanide bright copper process | |
Copper cyanide
riag Cu 390Bright cyanide copper barrel process | |
riag Cu 396Bright cyanide copper barrel process | |
riag Cu 397Bright cyanide copper rack process | |
Copper electroless
CUPRO-COAT 100Electroless plating copper bath | |